Live webinar · July 22, 2026

Why Passive Cooling Can't Keep Up with Edge AI and What to Do About It

Edge AI is taking over our devices. The bottleneck is heat. Manufacturers are stuck choosing between throttled performance, overheating surfaces, and bulkier designs. There's a better path.

Wednesday, July 22, 2026 · 1:15 PM ET · 60 minutes · Online (recorded)

Register — free

 The webinar will be recorded. Register to receive the recording and presentation slides automatically. 

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What you'll learn 

 
01

The passive cooling wall

Why today's thermal solutions can't keep pace with the next generation of edge AI hardware. 
 

02

Data Center Cooling in Your Pocket

How Boréas's piezo-driven micropump architecture brings microfluidic cooling to form factors where it was previously impossible. 

03

Real performance data

Live thermal imaging results showing the measurable difference active cooling makes versus passive baselines. 

04

Design for your architecture

A look at how the Boréas microfluidic cooling solution adapts to different physical constraints and device form factors. 

Learn from industry experts

Join our panelists for a discussion and Q&A about the benefits of Microfluidic Cooling.

Nate

Nate Coy

Account Manager

Boréas Technologies

Cédric Leclerc

Cedric Leclerc

Mechanical Engineer

Boréas Technologies

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Nate

Nate Coy

Nate Coy is Executive Account Manager at Boréas Technologies, helping bring innovative piezoelectric technologies to market. He works with global OEMs to develop next-generation haptic interfaces and thermal management solutions for consumer electronics and wearable devices. With a background spanning sales leadership, product commercialization and technology partnerships, Nate focuses on connecting breakthrough engineering with real-world product opportunities. His work supports the adoption of solid-state technologies that enable thinner, more reliable and more immersive electronic products. 

Cedric Leclerc

Cédric Leclerc is a Mechanical Engineer at Boréas Technologies, specializing in novel applications for low-power piezo drivers with a focus on active thermal management and haptic architectures. His current work centers on piezo microfluidics to solve complex heat management challenges in compact devices. He bridges mechanical design and embedded electronics with a philosophy that treats constraints as variables to be solved — moving quickly from system architecture to functional, production-aware hardware to fuel next-generation cooling solutions and haptic devices.

Cédric Leclerc